Silica powder can be used in plastics such as polyvinyl chloride (PVC) flooring, polyethylene and polypropylene film, and electrical insulation materials. The PVC floor tile filled with silica powdercan enhance the wear resistance of the product. In the PVC floor, the fineness of 320 mesh quartz powder, the filling amount is 160-180 parts, the floor is fully meet the requirements of GB4085-83 standard. The surface of the floor has good smoothness and good scratch resistance.
In the PVC acid-resistant tube, when the filling amount of 400 mesh silica powder is 10% to 15%, compared with other fillers, the viscosity is low, the fluidity is good, the processing performance is improved, and the extrusion and molding of the product are facilitated. The acid resistance of the obtained acid-resistant tube has been significantly improved. A silica powder filled polyethylene (PE) agricultural film with a large specific surface area (above 600 mesh) and high activity can improve the physicochemical properties and optical properties of the product, and filling the polypropylene can improve the mechanical properties of the product. Some people have studied the application of powdered quartz in PE film. The quartzite ore has been ultra-fine, graded, purified and surface-modified and filled in PE film. The use of quartz has the function of blocking infrared rays to slow the heat loss of plastic greenhouse. To improve its insulation performance. Through research, when ultrafine powder quartz is added in the PE film by 8% to 12%, the processing property is good, the filler has good dispersion and fluidity in the resin, and the distribution is uniform. The mechanical properties of the prepared PE film are close to the pure resin film, exceeding National standard requirements.
Among the epoxy molding compounds, high-purity silica powder is the main raw material. Because SiO2 has stable physicochemical properties, good light transmittance and linear expansion properties and excellent high temperature performance, SiO2 is currently the most ideal epoxy. The filling material of the molding compound is also the most ideal substrate material for the semiconductor integrated circuit. The annual dosage of epoxy plastic sealing materials is 10,000 tons, and the content of filler silica powder accounts for 70% to 90%. Therefore, only the plastic sealing industry, the amount of silica powderreaches 7000-9000t/year. In addition, the use of silica powderas an electronic substrate material is irreplaceable by other materials, and the prospects in this field are broader than the plastic packaging industry.
In terms of insulating materials, used silica powder as a filler in epoxy molding compound to develop SIEC special high pressure resistant ring with excellent electrical properties, high pressure resistance, excellent arc resistance, high surface resistivity and weather resistance. Oxygen molding compound, which is the material of choice for high voltage insulators and high voltage switches.
In the preparation of epoxy film plastics, the amount of silica powder accounts for 50% to 70% of the molding compound, and the plastic is a good new packaging material for low-voltage electrical appliances such as electromagnets for packaging valves.