The main features of electronic grade silica powder: high quality natural quartz is used as raw material; processed by special process; high silica content, low ion content and low conductivity. Application industry:
1. Ideal filling for electronic and electrical molding materials, molding compounds and high-performance electronic components.
2, used in the production of silicone rubber products, wear-resistant, heat-resistant, large filling.
3, fine powder can be used in the production of paints and coatings to wear high temperature resistant fillers. Electronic grade filler powder 1000 mesh silica powder, 800 mesh silica powder, filler, powder, 400 mesh silica powder, 600 mesh silica powder, 325 mesh silica powder.
the main application industry of electronic grade silica powder: electronic grade silica powder for electronic assembly materials:
1 Electronic packaging materials for LED, SMD, EMC electronic separation devices and electrical products. The main functions are waterproof, dustproof, anti-harmful gases, vibration reduction, external damage prevention and stable circuits.
Electronic grade ultra-fine high-purity quartz powder is the main raw material for large-scale integrated circuit substrate and electronic packaging materials. It is combined with epoxy resin to complete the bonding and sealing of chips or components. Ultra-fine quartz powder is epoxy resin. The ratio of incorporation determines the thermal expansion coefficient of the substrate. The higher the proportion of quartz powder, the smaller the thermal expansion coefficient of the substrate, which can avoid the uneven expansion and cause damage to the micro-scale of the silicon wafer. Therefore, the purity and fineness of the quartz powder There are strict requirements for the degree and particle size distribution.
The epoxy resin electronic material is filled with high-purity ultrafine and nano-silica in an amount of 70-90% or more. It has excellent processability, small shrinkage, small thermal expansion coefficient, good acid and alkali resistance and solvent insulation. Well, the epoxy resin has good transparency, 80% of the epoxy packaging materials in the electronic packaging materials, and 20% of the silicone packaging materials.
2 The electronic substrate material (electronic ceramic) can reduce the sintering temperature by adding ultra-fine ultra-pure quartz powder, and can play the role of two-phase and multi-phase toughening, compacting and strengthening strength. It is the basic raw material for packaging rubber products in the electronics industry.