Fused Silica Powder for EV Power Module Potting Compounds
Fused silica powder for EV inverter and power-module epoxy potting trials where low expansion and dimensional stability are required. Match purity and PSD to viscosity, vacuum filling, thermal cycling, dielectric strength and partial-discharge acceptance in the customer’s resin system.
Specifications
- Mesh Size
- 120mesh,200mesh,325mesh,600mesh,800mesh,1250mesh,2000mesh,2500mesh,3000mesh,5000mesh
- Particle Size
- 3-5mm,1-3mm,1-0.5mm,0.5-0.2mm,0.1-0.2mm,0.1-0mm(120mesh),0.075mm(200mesh)
- SiO₂ Content
- 99.8-99.99%
- Bulk Density
- 1.0~1.5 g/cm³
- Specific Gravity
- 2.20 g/cm³
- Thermal Expansion
- 0.5*10⁻⁶
- Moh's hardness
- 7
AMORPHOUS FUSED SILICA FOR EV POWER-MODULE POTTING
Low-expansion filler for inverter, charger and power-module encapsulation trials.
Product Overview
Changtong fused silica is an amorphous filler starting point for EV power-electronics potting. Reference values include SiO₂ >99.90%, Fe₂O₃ <50 ppm, specific gravity 2.21 g/cm³, thermal expansion 0.5 × 10⁻⁶ and 325–5000 mesh reference options.
Mesh is not a complete PSD. Define D-values, top cut, residue, moisture, loading, vacuum cycle and cure schedule against the actual gap and resin system, then confirm the current TDS/COA.
Material Identity and Grade Information
Grade-specific information — confirm the selected grade and test values before production use.
Material
Amorphous fused silica, distinct from cristobalite, crystalline silica and natural quartz sand.
Reference profile
Low-expansion, high-purity filler for epoxy potting and encapsulation screening.
Use case
EV inverter, on-board charger and power-module insulation trials.
Properties and Specification
| Property | Reference value | Project control |
|---|---|---|
| Structure | Amorphous fused silica | Confirm resin compatibility and module application. |
| SiO₂ | >99.90% | Confirm current TDS/COA and chemistry method. |
| Fe₂O₃ | <50 ppm | Agree impurity limit for electrical insulation. |
| Specific gravity | 2.21 g/cm³ | Confirm test method and lot value. |
| Thermal expansion | 0.5 × 10⁻⁶ material reference | Measure cured CTE, stress and thermal-cycle retention. |
| Powder range | 325–5000 mesh reference options | Specify D-values, top cut, residue and viscosity window. |
Data boundary: These are fused-silica material references, not finished-module results. Final grade is grade-specific, subject to current TDS/COA and customer trial.
Applications for EV Power-Module Potting
EV Inverter and Power Modules
Match viscosity and filler loading to gap size, vacuum process, cure exotherm and module geometry.
On-Board Charger Encapsulation
Check cured CTE, adhesion, crack resistance and thermal cycling against assembly materials.
Electrical Insulation
Measure dielectric strength, volume resistivity, moisture ageing and partial-discharge behaviour.
A Practical Grade-Selection Workflow
- Define the module target. Record gap size, resin chemistry, loading, operating temperature and electrical limits.
- Match PSD to process. Compare D-values, residue, moisture, vacuum degassing and flow at target temperature.
- Test the cured assembly. Measure voids, CTE, crack resistance, adhesion, dielectric strength and partial discharge.
- Approve a retained lot. Freeze grade, packing, cure window, test method and COA acceptance limits.
Production, Inspection and Quality Documents
Record resin lot, filler loading, mixing order, vacuum level, gap-fill result, cure exotherm and conditioning time. Request the applicable TDS and batch COA; retain potted coupons and electrical test records for comparison.
Related Changtong Products
For semiconductor molding compounds, review low-expansion fused silica for semiconductor EMC. For category browsing, see Fused Silica.
Request a Quote for EV Potting Filler
Share resin chemistry, target loading, gap size, mixing and vacuum process, cure schedule, operating temperature, electrical test method, country, Phone/WhatsApp and annual quantity.
Request a QuoteFAQ
Does low expansion alone prevent potting cracks?
No. Cure stress, adhesion, voids, module geometry and thermal cycling must be evaluated together.
Is mesh enough to specify the filler?
No. Use D-values, top cut, residue, moisture and the agreed test method for a reproducible PSD.
What should be included in an RFQ?
Specify resin, loading, gap, vacuum process, cure schedule, operating temperature, electrical limits, packing, country, Phone/WhatsApp and annual quantity.
